Global data consumption has been growing rapidly. With the development and expansion of the traditional Internet and the Internet of Things, the demand for high-speed and high-density IDC Latch Header has also increased, and new and flexible backplane solutions are needed to meet the speed requirements.
Not all backplanes are the same; they offer different functions. When creating networks, data centers, storage, and other equipment systems, it is necessary to understand key characteristics such as the required density, data rate, slot spacing, and bandwidth. The design of these characteristics is very crucial.
The most common design is the traditional backplane, which uses straight corner clips (RA DC) connected to the vertical backplane joint. Although designers are familiar with this architecture, compared with newer alternatives, it requires longer wiring channels and thicker substrates to meet the signal density requirements and wiring capabilities. These problems all limit the ability of the traditional backplane IDC Latch Header to adapt to higher data speeds, so designers are using a variety of innovative solutions to solve this problem.
The two commonly used backplane solutions for high-speed data transmission IDC Latch Header are as follows:
The four-way backplane is a solution. Some four-way backplane IDC Latch Header solutions offer more column-to-column space than traditional designs. They enable users to line four traces between through-hole columns by utilizing a 3mm column-to-column spacing compared to the traditional denser 1.9mm spacing. This reduces the number of signal layers required for wiring the IDC Latch Header.
The four-wire backplane solution with a spacing of 3 millimeters offers lower crosstalk. Its occupied space can generate strong signal integrity performance. However, the increased spacing will result in a larger spacing between the chips, which means fewer chips can be installed on the given card edge, thereby reducing the linear density of the IDC Latch Header.
2. Another option is the coplanar backplane (with right-angle male heads and right-angle sub-cards), which can support various I/O protocols and thus enable the use of pluggable modules. Essentially, the coplanar backplane is a bridge card that provides universal interconnection for various IDC Latch Header blades or line cards inserted into the backplane.
For example, some users may need to insert the RJ45IDC Latch Header blade into the backplane, but other users (such as high-end data centers) may need a faster data rate and zQSFP type I/O. On the coplanar backplane, users can change the connection of the Ethernet RJ45IDC Latch Header to an SFP connection without unplugging any plugs from the backplane. This allows system designers to use the existing backplane architecture while extending to various I/O protocols.
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